Wafer transfer device capable of smoothly transferring wafer between two wafer carriers

• Main Authors: SHIH, YING-RU, CHU, YUIH
• Format: Patent
• Language: Chinese; English
• Published: 01.01.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CONVEYING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING THIN OR FILAMENTARY MATERIAL; PACKING; PERFORMING OPERATIONS; PNEUMATIC TUBE CONVEYORS; SEMICONDUCTOR DEVICES; SHOP CONVEYOR SYSTEMS; STORING; TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING; TRANSPORTING

A wafer transfer device is provided for placement on a first wafer carrier and a second wafer carrier. The first wafer carrier comprises a plurality of first receiving slots, wherein each of first receiving slots is used for receiving a wafer. The second wafer carrier comprises a plurality of second receiving slots, wherein each of the second receiving slots is used for receiving a wafer. The wafer transfer device comprises a base, a guiding unit, and a pushing mechanism. The guiding unit comprises a first guiding frame having a plurality of first guiding grooves that are vertically arranged at intervals. The pushing mechanism may be controlled to push the wafers in the first receiving slots aligned with the second receiving slots, so that the wafers may be passed through the first guiding frame of the guiding unit from the first receiving slots and finally moved into the second receiving slots through the first guiding grooves.