Wafer tiling method to form large-area mold master having sub-micrometer features

• Main Authors: SOICHI, EMELINE, PENG, ZHEN, VO, SONNY
• Format: Patent
• Language: Chinese; English
• Published: 01.01.2020
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT THEREOF; MATERIALS THEREFOR; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS,MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES ASDISCRETE UNITS; NANOTECHNOLOGY; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; TRANSPORTING

A method of forming a large-area nanoimprint mold master is provided. The method comprises positioning a plurality of sub-master tiles on a rigid planar substrate. Each sub-master tile of the sub-master tile plurality has a nanoscale pattern and represents a subsection of the large-area nanoimprint mold master. The method further comprises adhering the plurality of sub-master tiles to the rigid planar substrate. The positioning determines a distance between a nanoscale feature of the nanoscale pattern on each sub-master tile of a pair of adjacent sub-master tiles. The distance has microscale positioning tolerance. Also provided are a large-area nanoimprint mold master and a method of large-area nanoimprint lithography.