Dicyclopentadiene structure-containing active polyester and low-dielectric epoxy resin cured product thereof having high thermal properties and low dielectric properties

The present invention provides a dicyclopentadiene structure-containing active polyester and a low-dielectric epoxy resin cured product thereof. The polyester has the following structure: R1 and R2 are selected from one of the group consisting of a hydrogen group, a C1-C6 alkyl group, a phenyl group...

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Bibliographic Details
Main Authors JUANG, TZONG-YUAN, LIN, CHIA-MIN, LIN, CHING-HSUAN, SU, WENIUNG, CHEN, CHIEN-HAN
Format Patent
LanguageChinese
English
Published 01.12.2019
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:The present invention provides a dicyclopentadiene structure-containing active polyester and a low-dielectric epoxy resin cured product thereof. The polyester has the following structure: R1 and R2 are selected from one of the group consisting of a hydrogen group, a C1-C6 alkyl group, a phenyl group, and a CF3 group, R3 is or, n is 20 a positive integer of 20-200. As a result, when the dicyclopentadiene and the active ester group are introduced into the polyester main chain, the epoxy cured product produced therefrom exhibits high thermal properties and low dielectric properties.
Bibliography:Application Number: TW20187114239