Light emitting diode package and method of manufacturing the same
A light emitting diode package includes a light emitting diode chip, a light conversion layer covering the light emitting diode chip, a reflecting layer surrounding the light emitting diode chip. The light emitting chip has a top surface, a first electrode and a second electrode. The first electrode...
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Main Author | |
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Format | Patent |
Language | Chinese English |
Published |
16.11.2019
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Subjects | |
Online Access | Get full text |
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Summary: | A light emitting diode package includes a light emitting diode chip, a light conversion layer covering the light emitting diode chip, a reflecting layer surrounding the light emitting diode chip. The light emitting chip has a top surface, a first electrode and a second electrode. The first electrode and the second electrode are opposite to the top surface. The light emitting diode package further includes a supporting layer made of metal material. The supporting layer is mounted on a bottom surface of the reflecting layer and surrounds the light emitting chip and the light conversion layer. |
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Bibliography: | Application Number: TW20187113408 |