Light emitting diode package and method of manufacturing the same

A light emitting diode package includes a light emitting diode chip, a light conversion layer covering the light emitting diode chip, a reflecting layer surrounding the light emitting diode chip. The light emitting chip has a top surface, a first electrode and a second electrode. The first electrode...

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Bibliographic Details
Main Author CHENG, CHIN-FU
Format Patent
LanguageChinese
English
Published 16.11.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A light emitting diode package includes a light emitting diode chip, a light conversion layer covering the light emitting diode chip, a reflecting layer surrounding the light emitting diode chip. The light emitting chip has a top surface, a first electrode and a second electrode. The first electrode and the second electrode are opposite to the top surface. The light emitting diode package further includes a supporting layer made of metal material. The supporting layer is mounted on a bottom surface of the reflecting layer and surrounds the light emitting chip and the light conversion layer.
Bibliography:Application Number: TW20187113408