Metal powder

The aim of the present invention is to provide a metal powder for an electroconductive paste with which a low-resistance electrode film can be formed. One embodiment of the present invention relates to a platinum-containing or platinum-alloy-containing metal powder for an electroconductive paste, th...

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Bibliographic Details
Main Authors MAETO, KEISUKE, NAGAOKA, AKIO, HOSOI, TAKUYA
Format Patent
LanguageChinese
English
Published 01.11.2019
Subjects
ALLOYS
BASIC ELECTRIC ELEMENTS
CABLES
CASTING
CHEMISTRY
CONDUCTORS
ELECTRICITY
FERROUS OR NON-FERROUS ALLOYS
INSULATORS
MAKING METALLIC POWDER
MANUFACTURE OF ARTICLES FROM METALLIC POWDER
METALLURGY
PERFORMING OPERATIONS
POWDER METALLURGY
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
WORKING METALLIC POWDER
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Summary:The aim of the present invention is to provide a metal powder for an electroconductive paste with which a low-resistance electrode film can be formed. One embodiment of the present invention relates to a platinum-containing or platinum-alloy-containing metal powder for an electroconductive paste, the metal powder including a metal element or metal elements other than Pt, wherein the metal elements other than Pt include at least Ca, and may further include Al and Zr, and the total content of the Ca, Al and Zr among the metal elements other than Pt is 10-900 mass ppm.
Bibliography:Application Number: TW20198111275