Substrate alignment method, substrate alignment device, substrate processing method, and substrate processing device

• Main Authors: HOSHINO, HIROZUMI, ONZUKA, KEIJI
• Format: Patent
• Language: Chinese; English
• Published: 16.10.2019
• Subjects: BASIC ELECTRIC ELEMENTS; CONVEYING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING THIN OR FILAMENTARY MATERIAL; PACKING; PERFORMING OPERATIONS; PNEUMATIC TUBE CONVEYORS; SEMICONDUCTOR DEVICES; SHOP CONVEYOR SYSTEMS; STORING; TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING; TRANSPORTING

An object of the invention is to prevent a substrate from contacting substrate support bodies and other substrates even when warping (deformation) of the substrate occurs. The present invention is configured such that the substrate support body (39) can be moved toward the center of a substrate (8) from a position other than positions (A and C) at which the substrate (8) is partially warped upward along the outer peripheral edge and positions (B and D) at which it is warped downward. The present invention can be applied to a substrate alignment method (substrate alignment device) that aligns one or a plurality of substrates (8), a substrate receiving method (substrate receiving device) where the substrate (8) is received by the substrate support body (39), a substrate liquid processing method (substrate liquid processing device) that can process a plurality of substrates (8) in a single batch, and a substrate processing system (1) that incorporates such a substrate alignment device, substrate receiving device