Temperature sensor element

• Main Authors: HINRICH, ANDREAS, BLEIFUSS, MARTIN, URFELS, STEPHAN
• Format: Patent
• Language: Chinese; English
• Published: 01.10.2019
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CASTING; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MEASURING; MEASURING QUANTITY OF HEAT; MEASURING TEMPERATURE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; PHYSICS; POLISHES; POWDER METALLURGY; SEMICONDUCTOR DEVICES; TESTING; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR; TRANSPORTING; USE OF MATERIALS AS ADHESIVES; WORKING METALLIC POWDER

A temperature sensor element for connection to an electronic component (17) or an electronic sub-assembly, comprising: at least one electrically insulating substrate (3); at least one sensor structure (7) with contact surfaces (5a, 5b) for contacting the sensor structure (7) while it is arranged, at least by regions thereof, on a first side of the electrically insulating substrate (3); and (i) at least one adhesive (12) that is at least partially pre-applied to a second side of the electrically insulating substrate (3), whereby the first side is situated opposite from the second side, or (ii) at least one metallisation layer (9) that is arranged, at least by regions thereof, on the second side of the electrically insulating substrate (3), and at least one sintering paste (11) that is at least partially pre-applied to the metallisation layer (9). The present invention also relates to a system for transporting a temperature sensor element and to a method for the production of a temperature sensor element.