Cooling device
Provided is a cooling device capable of improving bonding reliability between a base block and a heat pipe, while reducing environmental load, and capable of achieving both excellent contact heat transfer coefficient and vibration resistance. A cooling device (1) is provided with: a base block (10)...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
16.08.2019
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Subjects | |
Online Access | Get full text |
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