Cooling device
Provided is a cooling device capable of improving bonding reliability between a base block and a heat pipe, while reducing environmental load, and capable of achieving both excellent contact heat transfer coefficient and vibration resistance. A cooling device (1) is provided with: a base block (10)...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
16.08.2019
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Subjects | |
Online Access | Get full text |
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Summary: | Provided is a cooling device capable of improving bonding reliability between a base block and a heat pipe, while reducing environmental load, and capable of achieving both excellent contact heat transfer coefficient and vibration resistance. A cooling device (1) is provided with: a base block (10) having a rear surface section (10a) thermally connected to an electric component (300), i.e., a heat generating body; a heat pipe group (20) comprising a plurality of heat pipes (21) each having a first cylindrical section (21a), which is fixed to a front surface section (10b) of the base block (10), and which is disposed in the in-plane direction of the base block (10), and a second cylindrical section (21b), which is connected to the first cylindrical section (21a), and which stands from the base block (10); and a fin group (30) comprising a plurality of fins (31, 31, and so on) that are fixed by being aligned in parallel to each other in the standing direction of the heat pipe group (20). |
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Bibliography: | Application Number: TW20187147645 |