System and method for mounting a flip chip

A system for mounting a flip chip, comprising: at least one flipper arm, having an engagement end; said flipper arm arranged to rotate in a vertical plane; said engagement end arranged to engage a chip and, on engagement, rotate 180 DEG.

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Bibliographic Details
Main Authors JUNG, JONG-JAE, SHIN, YUN-SUK, JANG, DEOKUN
Format Patent
LanguageChinese
English
Published 01.06.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A system for mounting a flip chip, comprising: at least one flipper arm, having an engagement end; said flipper arm arranged to rotate in a vertical plane; said engagement end arranged to engage a chip and, on engagement, rotate 180 DEG.
Bibliography:Application Number: TW20180134213