Die bonding apparatus and manufacturing method of semiconductor device capable of detecting an abnormality of a bonding head

• Main Author: TATE, MITSUAKI
• Format: Patent
• Language: Chinese; English
• Published: 01.05.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The subject of the present invention is to provide a die bonding apparatus having a means for detecting an abnormality of a bonding head and the like. To solve the problem, the die bonding apparatus includes a die supply part, a substrate supply part, a bonding part for bonding a die supplied from the die supply part onto a substrate supplied from the substrate supply part or onto a die already bonded to the substrate, and a control unit for controlling the die supply part, the substrate supply part and the bonding part. The bonding part includes a bonding head having a chuck for attracting the die, a driving unit having a driving shaft for moving the bonding head, and a sensor capable of detecting an angular velocity and an acceleration of the bonding head. Based on the result obtained by the sensor, the control unit compares a vibration displacement with a predetermined threshold value of vibration displacement to determine an abnormality.