Package structure

A package structure includes a sub-package, a conductive structure, and at least one first antenna. The sub-package includes at least one chip. The conductive structure is bonded onto and electrically connected to the sub-package. The at least one first antenna has a vertical polarization and is ele...

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Bibliographic Details
Main Authors TANG, TZUUN, WANG, CHUEI-TANG, TSAI, CHUNG-HAO, YU, CHEN-HUA
Format Patent
LanguageChinese
English
Published 16.04.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A package structure includes a sub-package, a conductive structure, and at least one first antenna. The sub-package includes at least one chip. The conductive structure is bonded onto and electrically connected to the sub-package. The at least one first antenna has a vertical polarization and is electrically connected to the at least one chip, wherein the at least one first antenna is partially located in the sub-package, and the at least one first antenna is extended within the sub-package into the conductive structure.
Bibliography:Application Number: TW20187133380