Workpiece grinding method

A method of grinding a back side of a workpiece having a device region and a peripheral surplus region on a front side thereof includes covering the front side of the workpiece with a protective member, holding a protective member side of the workpiece by a holding surface of a chuck table that is r...

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Bibliographic Details
Main Author KAKEFUDA, MASAKI
Format Patent
LanguageChinese
English
Published 16.04.2019
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:A method of grinding a back side of a workpiece having a device region and a peripheral surplus region on a front side thereof includes covering the front side of the workpiece with a protective member, holding a protective member side of the workpiece by a holding surface of a chuck table that is rotated around a rotational axis inclined at an angle of 45 to 180 degrees relative to a vertical direction, and grinding the back side of the workpiece corresponding to the device region by a grindstone rotated around a rotational axis orthogonal to the holding surface while supplying grinding water, to form a circular recess and an annular reinforcement section surrounding the circular recess. When grinding, discharge of the grinding water containing abrasive grains dropped from the grindstone is promoted by the inclination of the workpiece.
Bibliography:Application Number: TW20187135335