Fan-out semiconductor package

A fan-out semiconductor package includes: a core member including a plurality of insulating layers and a plurality of wiring layers and having a blind cavity penetrating through a portion of the plurality of insulating layers; a semiconductor chip disposed in the blind cavity; an encapsulant encapsu...

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Bibliographic Details
Main Authors SO, WON-WOOK, BAEK, YONG-HO, KIM, DOO-IL, HUR, YOUNG-SIK
Format Patent
LanguageChinese
English
Published 01.04.2019
Subjects
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A fan-out semiconductor package includes: a core member including a plurality of insulating layers and a plurality of wiring layers and having a blind cavity penetrating through a portion of the plurality of insulating layers; a semiconductor chip disposed in the blind cavity; an encapsulant encapsulating at least portions of the core member and an active surface of the semiconductor chip and filling at least portions of the blind cavity; and a connection member disposed on the core member and an active surface of the semiconductor chip and including a redistribution layer connected to the connection pads. The plurality of wiring layers include antenna patterns and ground patterns, the antenna patterns and the ground patterns are disposed on different levels, and the antenna patterns are connected to the connection pads through the redistribution layer.
Bibliography:Application Number: TW20187115673