Sealing sheet

• Main Authors: HABU, TAKASHI, IINO, CHIE, SHIMIZU, YUUSAKU
• Format: Patent
• Language: Chinese; English
• Published: 01.04.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; TRANSPORTING

A sealing sheet for sealing an electronic element, the electronic element spaced apart from a board with a gap provided therebetween, to be electrically connected to the board, and to be sealed with the sealing sheet to allow the gap to be hollow. The sealing sheet includes a first layer and a second layer sequentially toward one side in a thickness direction; at the time of sealing of the electronic element, the first layer is brought into contact with the electronic element and the second layer is exposed outwardly; the first layer contains a first thermosetting resin and a first thermoplastic resin; the second layer contains a second thermosetting resin, a second thermoplastic resin, and an inorganic filler; and a thickness Tl (/lm) of the first layer and a percentage X (%) of the second thermoplastic resin with respect to the total amount of the second thermosetting resin and the second thermoplastic resin in terms of mass satisfy the following formula () or formula (2): Tl ≤ 2X+5(0 < X < 1O) (1) Tl ≤ 3.5