Resin composition, production method for resin film, and production method for electronic device

• Main Authors: UEOKA, KOJI, ASHIBE, TOMOKI
• Format: Patent
• Language: Chinese; English
• Published: 01.04.2019
• Subjects: LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; PERFORMING OPERATIONS; TRANSPORTING

Provided is a resin composition which comprises (a) at least one resin selected from among polyimides and polyimide precursors and (b) a solvent, characterized by having a loss tangent (tan[delta]) represented by equation (I) of 150 or greater but less than 550 when examined for dynamic viscoelastic...