Resin composition, production method for resin film, and production method for electronic device

Provided is a resin composition which comprises (a) at least one resin selected from among polyimides and polyimide precursors and (b) a solvent, characterized by having a loss tangent (tan[delta]) represented by equation (I) of 150 or greater but less than 550 when examined for dynamic viscoelastic...

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Bibliographic Details
Main Authors UEOKA, KOJI, ASHIBE, TOMOKI
Format Patent
LanguageChinese
English
Published 01.04.2019
Subjects
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
TRANSPORTING
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Summary:Provided is a resin composition which comprises (a) at least one resin selected from among polyimides and polyimide precursors and (b) a solvent, characterized by having a loss tangent (tan[delta]) represented by equation (I) of 150 or greater but less than 550 when examined for dynamic viscoelasticity under the conditions of a temperature of 22 DEG C and a circular frequency of 10 rad/s. Coating films of the resin composition are free from troubles such as film burst during vacuum drying, and give films having satisfactory thickness evenness and mechanical properties. tan[delta] = G"/G' (I) (In equation (I), G' indicates the storage modulus of resin composition and G" indicates the loss modulus of resin composition).
Bibliography:Application Number: TW20187125915