Substrate film for dicing

A purpose of the present invention is to provide a substrate film for dicing having high heat resilience and excellent rack recovery properties. A further purpose of the present invention is to provide a substrate film for dicing in which a dicing film stretches uniformly even when expansion is perf...

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Bibliographic Details
Main Authors KURIHARA, KEITA, SUETO, SOICHI, TSUKADA, SHOICHI
Format Patent
LanguageChinese
English
Published 01.04.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:A purpose of the present invention is to provide a substrate film for dicing having high heat resilience and excellent rack recovery properties. A further purpose of the present invention is to provide a substrate film for dicing in which a dicing film stretches uniformly even when expansion is performed under the condition of a low temperature. The substrate film for dicing comprises a surface layer/an intermediate layer/a back layer laminated in this order, wherein the surface layer and the back layer are composed of a resin composition including a polyethylene-based resin, and the intermediate layer is composed of a resin composition including a polyurethane-based resin.
Bibliography:Application Number: TW20187129168