Package structure and method of fabricating the same

A package structure has a chip, a molding compound encapsulating the chip and an inductor structure disposed above the chip. A vertical projection of the inductor structure at least partially overlaps with a vertical projection of the chip.

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Bibliographic Details
Main Authors CHEN, WEI-TING, CHEN, CHIEH-YEN, WANG, CHUEI-TANG, TANG, TZUUN, YU, CHEN-HUA
Format Patent
LanguageChinese
English
Published 16.03.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A package structure has a chip, a molding compound encapsulating the chip and an inductor structure disposed above the chip. A vertical projection of the inductor structure at least partially overlaps with a vertical projection of the chip.
Bibliography:Application Number: TW20176143034