Electrical test structure
An electrical test structure including following elements. (n+1) metal layers are sequentially disposed on the substrate, wherein n is an integer of 2 or more. Each of n vias is connected between two vertically adjacent metal layers. (2n+2) pads are electrically connected to the (n+1)th metal layer....
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
16.03.2019
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Subjects | |
Online Access | Get full text |
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Summary: | An electrical test structure including following elements. (n+1) metal layers are sequentially disposed on the substrate, wherein n is an integer of 2 or more. Each of n vias is connected between two vertically adjacent metal layers. (2n+2) pads are electrically connected to the (n+1)th metal layer. (n+1) pad groups are formed by arranging two pads as a group. (n+1) connection conductive lines are respectively a portion of the (n+1) metal layers. The two pads in each of the pad groups are electrically connected by using one of (n+1) connection conductive lines. Different pad groups use different connection conductive lines for electrical connection between the two pads. (n+1) connection conductive lines have an overlapping portion in the vertical direction, and the (n+1) connection conductive lines are electrically connected to each other in the overlapping portion by the n vias. |
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Bibliography: | Application Number: TW20170126610 |