Heat exchange apparatus, and heat exchange method therefor and vapour deposition device thereof

• Main Authors: WANG, YU-FENG, YANG, TENG-JUN
• Format: Patent
• Language: Chinese; English
• Published: 01.03.2019
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

Provided are a heat exchange apparatus, and a heat exchange method therefor and a vapour deposition device thereof. The heat exchange apparatus is used for performing cooling processing on a target object to be cooled, and comprises a heat exchanger, cooling water channels, water circulation channels and switchers, wherein the cooling water channels are used for realizing heat exchange between cooling water and the heat exchanger, the water circulation channels are used for performing temperature control on the target object to be cooled, and the switchers are used for disconnecting the water circulation channels from the target object to be cooled, and at the same time realizing the connection between the cooling water channels and the target object to be cooled. In addition to normally realizing circulation cooling through the heat exchanger, the heat exchange apparatus can also realize cooling with the cooling water provided by a cooling water inlet pipe when the heat exchanger fails, thereby ensuring that