Method and device for bonding chips

What is proposed is a method for bonding chips (7) onto a substrate (11') or onto further chips, characterized in that the chips (7) are bonded onto the substrate (11') or the further chips by means of a direct bond.

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Bibliographic Details
Main Author WIMPLINGER, MARKUS
Format Patent
LanguageChinese
English
Published 01.12.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:What is proposed is a method for bonding chips (7) onto a substrate (11') or onto further chips, characterized in that the chips (7) are bonded onto the substrate (11') or the further chips by means of a direct bond.
Bibliography:Application Number: TW20187105628