Thermosetting resin composition, cured film, substrate having cured film, electronic component, and ink composition for inkjet

In order to provide good adhesion to a substrate, flux resistance, solder resistance, and solvent resistance, this thermosetting resin composition contains a polyester amide acid (A), an epoxy compound (B) having a weight-average molecular weight of less than 10,000, and a copolymer (C) having oxira...

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Bibliographic Details
Main Authors FURUTA, TOMOTSUGU, MOROKOSHI, SHINTA, TAKAHASHI, TOSHIYUKI
Format Patent
LanguageChinese
English
Published 01.12.2018
Subjects
ADHESIVES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMICAL PAINT OR INK REMOVERS
CHEMISTRY
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
CORRECTING FLUIDS
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FILLING PASTES
INKS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
POLISHES
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS THEREFOR
WOODSTAINS
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Summary:In order to provide good adhesion to a substrate, flux resistance, solder resistance, and solvent resistance, this thermosetting resin composition contains a polyester amide acid (A), an epoxy compound (B) having a weight-average molecular weight of less than 10,000, and a copolymer (C) having oxiranyl or oxetanyl and having a weight-average molecular weight of 10,000 or more.
Bibliography:Application Number: TW20187105101