Molding material, resin molded article, cosmetic container, semiconductor container, and production method for semiconductor container

• Main Authors: KATO, AYAKO, ARIURA, EITO, MIYAZAWA, SHINSUKE, YAMADA, SATOSHI
• Format: Patent
• Language: Chinese; English
• Published: 01.12.2018
• Subjects: ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; CONVEYING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HAIRDRESSING OR SHAVING EQUIPMENT; HAND OR TRAVELLING ARTICLES; HANDLING THIN OR FILAMENTARY MATERIAL; HUMAN NECESSITIES; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANICURING OR OTHER COSMETIC TREATMENT; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PACKAGES; PACKAGING ELEMENTS; PACKING; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; STORING; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Provided is a molding material containing an alicyclic structure-containing resin having crystallinity. More specifically, in the molding material, the alicyclic structure-containing resin having crystallinity has a melting point of 200 DEG C or higher, and the contained amount of chlorobenzene-soluble components in the molding material is 1,000 ppm or less in terms of o-dichlorobenzene based on gas chromatography analysis in which o-dichlorobenzene is used as the reference material.