Thermosetting resin composition, cured film, substrate having cured film, electronic component, and ink composition for inkjet

• Main Authors: FURUTA, TOMOTSUGU, MOROKOSHI, SHINTA, TAKAHASHI, TOSHIYUKI
• Format: Patent
• Language: Chinese; English
• Published: 01.11.2018
• Subjects: ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COLOUR PRINTING; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CORRECTING FLUIDS; CORRECTION OF TYPOGRAPHICAL ERRORS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; INKS; LINING MACHINES; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PERFORMING OPERATIONS; POLISHES; PRINTED CIRCUITS; PRINTING; PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; SELECTIVE PRINTING MECHANISMS; STAMPS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; TYPEWRITERS; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS THEREFOR; WOODSTAINS

In order to be capable of forming a cured product having superior adhesion to a substrate, flux resistance, solder resistance, and solvent resistance, and in order to enable temporal curing, this thermosetting resin composition contains a polyester amide acid (A), an epoxy compound (B) having a weight-average molecular weight of less than 10,000, a copolymer (C) having oxiranyl or oxetanyl, a solvent (D), a coloring agent (E), a (meth)acrylate (G) having three or more functional groups, and a polymerization initiator (H).