Resin material and laminate

• Main Authors: OOWASHI, KEIGO, ASHIBA, KOUJI, KAWAHARA, YUKO, SUGIMOTO, MASATAKA
• Format: Patent
• Language: Chinese; English
• Published: 16.09.2018
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

Provided is a resin material with which it is possible to effectively increase insulating properties and heat conductivity, and effectively curb variation in breakdown strength. This resin material contains first boron nitride cohesive particles and second boron nitride cohesive particles, and a binder resin. The 10% K value of the second boron nitride cohesive particles is smaller than the 30% K value of the second boron nitride cohesive particles, and the 30% K value of the second boron nitride cohesive particles is smaller than the 10% K value of the first boron nitride cohesive particles.