Resin material and laminate

Provided is a resin material with which it is possible to effectively increase insulating properties and heat conductivity, and effectively curb variation in breakdown strength. This resin material contains first boron nitride cohesive particles and second boron nitride cohesive particles, and a bin...

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Bibliographic Details
Main Authors OOWASHI, KEIGO, ASHIBA, KOUJI, KAWAHARA, YUKO, SUGIMOTO, MASATAKA
Format Patent
LanguageChinese
English
Published 16.09.2018
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL PROCESSES OF COMPOUNDING
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WORKING-UP
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Summary:Provided is a resin material with which it is possible to effectively increase insulating properties and heat conductivity, and effectively curb variation in breakdown strength. This resin material contains first boron nitride cohesive particles and second boron nitride cohesive particles, and a binder resin. The 10% K value of the second boron nitride cohesive particles is smaller than the 30% K value of the second boron nitride cohesive particles, and the 30% K value of the second boron nitride cohesive particles is smaller than the 10% K value of the first boron nitride cohesive particles.
Bibliography:Application Number: TW20187103323