Resin composition, film, method for making the same and circuit board using the same

• Main Authors: TENG, CHIA-YIN, KAO, YU-WEN, SU, SZU-HSIANG, HSU, MAO-FENG, HSIANG, SHOU-JUI, HO, MING-JAAN, CHENG, YAO-YI, HSIAO, HSIN-MIN
• Format: Patent
• Language: Chinese; English
• Published: 01.09.2018
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

A method for making a resin composition includes following steps of providing a maleated cyclic olefins copolymer and/or a carbic anhydride modified cyclic olefins copolymer; providing a polyamic acid solution; dissolving the maleated cyclic olefins copolymer and/or the carbic anhydride modified cyclic olefins copolymer in a solvent, and adding the polyamic acid solution, wherein the resin composition includes a first product selected from a group consisting of a material having a chemical structural formula. A resin composition, a film, a method for making the film, and a circuit board are also provided.