Resist substrate preprocessing composition and resist substrate manufacturing method

• Main Authors: TAKEDA, TAKUMA, SATO, SHOHEI
• Format: Patent
• Language: Chinese; English
• Published: 16.07.2018
• Subjects: ACYCLIC OR CARBOCYCLIC COMPOUNDS; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC CHEMISTRY; PERFORMING OPERATIONS; PRINTED CIRCUITS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

Provided is a resist substrate preprocessing composition with which wetting and spreading of resist ink after application by an inkjet method can be suppressed, making it possible to form a fine resist pattern with high accuracy. The resist substrate preprocessing composition of the present invention is a resist substrate preprocessing composition which contains an ampholytic surface-active agent (A1), an anionic surface-active agent (A2), and water, characterized in that: a numerical value obtained by subtracting, from a numerical value of an isoelectric point of the ampholytic surface-active agent (A1), a numerical value of the pH of the resist substrate preprocessing composition ([numerical value of isoelectric point of ampholytic surface-active agent (A1)] - [numerical value of pH of resist substrate preprocessing composition]) is -3 to 4; and the ratio of the mole number of the ampholytic surface-active agent (A1) to a total mole number of the mole number of the ampholytic surface-active agent (A1) and t