Semiconductor device and method of manufacturing thereof
A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device comprising a semiconductor die coupled to a substrate and surrounded by a perforated metal plane and a method of manufacturing the...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
16.06.2018
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Subjects | |
Online Access | Get full text |
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Summary: | A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device comprising a semiconductor die coupled to a substrate and surrounded by a perforated metal plane and a method of manufacturing thereof. |
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Bibliography: | Application Number: TW20176100154 |