Lens shell assembly of wafer inspection equipment capable of preventing chips on inspected wafer from being detached from dicing tape or colliding with each other

• Main Author: CHEN, JIANNG
• Format: Patent
• Language: Chinese; English
• Published: 16.05.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS; SEMICONDUCTOR DEVICES

The present invention provides a lens shell assembly of wafer inspection equipment, which comprises an outer shell having a top portion, wherein the outer shell is provides with a first hole on the top portion and a groove on the outer perimeter; a transparent sheet disposed on the outer shell and covering the first hole; an outer cap disposed on the outer shell and provided with a second hold and a third hole, wherein a first gap is formed between the outer cap and the outer shell, and the first gap communicates with the second hole and the third hole; and a frame fitted on the outer shell or the outer cap, wherein the frame is located above the groove and provides with a top edge, and the position of the top edge is the same or higher than the outer cap. Thus, the present invention may reduce the possibility that the chips on the inspected wafer may be detached from the dicing tape or collided with each other, and may also reduce the residual liquid on the dicing tape.