An aluminum alloy substrate with pure aluminum bonds on the surface

The present invention relates to an aluminum alloy base having a surface of pure aluminum. The aluminum substrate can therefore enhance the selectivity of the subsequent of the surface treatments; for example, electrolytic polishing or anodization. There has not any solders added between pure alumin...

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Bibliographic Details
Main Authors HUN, CHIEN-WAN, LIN, MING-YUAN, YANG, JHENG-EN, LI, LU-LIN, BAI, CHING-YUAN, CHEN, CHIENON, CHANG, SHAO-FU, CHEN, CHIH-YUAN
Format Patent
LanguageChinese
English
Published 16.03.2018
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
PERFORMING OPERATIONS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS
TRANSPORTING
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Summary:The present invention relates to an aluminum alloy base having a surface of pure aluminum. The aluminum substrate can therefore enhance the selectivity of the subsequent of the surface treatments; for example, electrolytic polishing or anodization. There has not any solders added between pure aluminum and aluminum alloy interface, but applied a pressure and a temperature for aluminum and aluminum alloy making diffusion effect and bounding of pure aluminum and aluminum alloy together.
Bibliography:Application Number: TW20160112070