Process for depositing a metal or metal alloy on a surface of a substrate including its activation
The present invention relates to a process for depositing a metal or metal alloy on at least one surface of a substrate comprising the steps of (a) providing said substrate; (b) treating the surface of said substrate with an activation solution comprising at least one source of metal ions selected f...
Saved in:
Main Authors | , , , , , |
---|---|
Format | Patent |
Language | Chinese English |
Published |
01.03.2018
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | The present invention relates to a process for depositing a metal or metal alloy on at least one surface of a substrate comprising the steps of (a) providing said substrate; (b) treating the surface of said substrate with an activation solution comprising at least one source of metal ions selected from the group consisting of ruthenium, rhodium, palladium, osmium, iridium, platinum, copper, silver, nickel, cobalt, gold and mixtures thereof such that at least one portion of said metal ions is being adsorbed on the surface of said substrate; (c) treating the surface of said substrate obtained from step (b) with a treatment solution comprising (i) at least one additive independently selected from the group consisting of thiols, thioethers, disulphides and sulphur containing heterocycles, and (ii) at least one reducing agent suitable to reduce the metal ions adsorbed on the surface of said substrate selected from the group consisting of boron based reducing agents, sources of hypophosphite ions, hydrazine and hyd |
---|---|
Bibliography: | Application Number: TW20176114766 |