Method for adjustment of parameters for deposition process and machine readable medium for storage

• Main Authors: CHEN, PEI-NUNG, LIN, CHIEN-FENG, LIU, HSU-SHUI, HUNG, SHIH-WEI
• Format: Patent
• Language: Chinese; English
• Published: 01.01.2018
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; CONTROL OR REGULATING SYSTEMS IN GENERAL; CONTROLLING; DIFFUSION TREATMENT OF METALLIC MATERIAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS; PHYSICS; REGULATING; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

A method for adjustment of parameters for a deposition process includes receiving at least one geometric parameter and at least one parameter of heat radiation of at least one process chamber; building up a process model according to the geometric parameter and the parameter of heat radiation; simulating the deposition process according to the process model, in order to predict at least one physical field in the process chamber; and adjusting at least one parameter of the deposition process according to the physical field and carrying out the deposition process accordingly.