Assembling device used for semiconductor equipment

The present invention is directed to an assembling device used for semiconductor equipment. The assembling device includes a chamber lid, a ceiling, a suspension part and a driving part. The ceiling is disposed below the chamber lid. The suspension part is inserted through the chamber lid, and hooke...

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Bibliographic Details
Main Authors HUANG, TSAN-HUA, WONG, PAUL
Format Patent
LanguageChinese
English
Published 16.12.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention is directed to an assembling device used for semiconductor equipment. The assembling device includes a chamber lid, a ceiling, a suspension part and a driving part. The ceiling is disposed below the chamber lid. The suspension part is inserted through the chamber lid, and hooked with the ceiling. The driving part is disposed over the chamber lid and connected to the suspension part, and configured to drive the suspension part. The driving part has a lifting and lowering unit and a rotating unit. The lifting and lowering unit and a rotating unit are respectively configured to lift and lower and rotate the supporting part.
Bibliography:Application Number: TW20165118226