Method of manufacturing semiconductor devices by using sampling plans

A method of manufacturing semiconductor devices includes defining a sampling plan that contains position information about metrology sites on process wafers. A first property of the process wafers is measured to obtain measurement values at measurement points, wherein a quantity of the measurement p...

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Bibliographic Details
Main Authors ROESSIGER, MARTIN, HABETS, BORIS, BUHL, STEFAN, ERLEY, GEORG
Format Patent
LanguageChinese
English
Published 16.11.2017
Subjects
CONTROL OR REGULATING SYSTEMS IN GENERAL
CONTROLLING
FUNCTIONAL ELEMENTS OF SUCH SYSTEMS
MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS
PHYSICS
REGULATING
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Summary:A method of manufacturing semiconductor devices includes defining a sampling plan that contains position information about metrology sites on process wafers. A first property of the process wafers is measured to obtain measurement values at measurement points, wherein a quantity of the measurement points per process wafer is at least tenfold a quantity of the metrology sites. A sampling model that includes at least a wafer model is updated on the basis of the measurement values. The sampling plan is updated on the basis of an assessment of deviations of the measurement values from a current sampling model.
Bibliography:Application Number: TW20176101247