Continuous hot-dip metal plating device and continuous hot-dip metal plating method

• Main Authors: OMODAKA, MASAAKI, NISHIZAWA, KOICHI
• Format: Patent
• Language: Chinese; English
• Published: 16.11.2017
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

Provided is a continuous hot-dip metal plating device comprising: a sink roll that is disposed inside a plating bath, and changes the conveyance direction of a steel strip to upward; a first support roll that is positioned inside the plating bath higher than the sink roll, and contacts a surface of the steel strip that is in contact with the sink roll; and a second support roll that is positioned inside the plating bath higher than the first support roll, and contacts the reverse surface to the surface of the steel strip that is in contact with the sink roll, wherein the diameter of the first support roll, the diameter of the second support roll, and the distance in the vertical direction between the rotation axis of the first support roll and the rotation axis of the second support roll satisfy specific conditions.