Composition for non-conductive adhesive film and non-conductive adhesive film including the same

The present invention relates to a composition for a non-conductive adhesive film and a non-conductive adhesive film including the same and, in particular, to a composition for a non-conductive adhesive film and a non-conductive adhesive film including the same as described below. That is to say, th...

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Bibliographic Details
Main Authors CHOI, JAE-WON, CHAE, SUNG-WON, LEE, DONG-YUL, YOON, KEUN-YOUNG, PARK, DUCK-HA
Format Patent
LanguageChinese
English
Published 16.11.2017
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:The present invention relates to a composition for a non-conductive adhesive film and a non-conductive adhesive film including the same and, in particular, to a composition for a non-conductive adhesive film and a non-conductive adhesive film including the same as described below. That is to say, the resin flow can be minimized during the welding process performed between chips or between a chip and a substrate by improving the curing speed, thereby increasing productivity, bump filling, and the adhesion of the semiconductor chip. The present invention has excellent thermal stability to realize heat resistance required by semiconductor products.
Bibliography:Application Number: TW20176111398