Resin molding apparatus, resin molding method, method for manufacturing resin-molded component, and method for manufacturing products comprising a coating mechanism for coating resin on an object and a compression molding mechanism to carry out compression molding of the object that is coated with the resin

• Main Authors: KAWAMOTO, YOSHIHISA, MIZUMA, KEITA, OKAMOTO, RYOTA
• Format: Patent
• Language: Chinese; English
• Published: 01.11.2017
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

An object of the present invention is to provide a resin molding apparatus for flowable resin that helps reduce thickness deviation of resin of a molded product. To achieve the above object, the resin molding apparatus of the present invention is characterized by comprising a coating mechanism (520) for coating flowable resin for resin molding on a coating area of a coating target (11), a compression molding mechanism (530) for carrying out compression molding of the coating target (11) that is coated with the flowable resin with the coating mechanism (520). The coating mechanism (520) comprises: a discharge mechanism that discharges the flowable resin from at least a portion of the coating area; and a resin spreading mechanism that applies a force to the flowable resin discharged by the resin discharging mechanism in order to spread the flowable resin.