Service tunnel for use on capital equipment in semiconductor manufacturing and research fabs

A system for processing substrates is provided, comprising: a wafer transport assembly that is configured to transport wafers to and from one or more process modules, the wafer transport assembly having at least one wafer transport module, wherein lateral sides of the at least one wafer transport mo...

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Bibliographic Details
Main Authors GOULD, RICHARD, PENA, CHRISTOPHER, KELLOGG, MICHAEL, DAUGHERTY, JOHN, KUNKEL, KLAY, TRUSSELL, DAVID
Format Patent
LanguageChinese
English
Published 01.08.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A system for processing substrates is provided, comprising: a wafer transport assembly that is configured to transport wafers to and from one or more process modules, the wafer transport assembly having at least one wafer transport module, wherein lateral sides of the at least one wafer transport module are configured to couple to the one or more process modules; a service floor defined below the wafer transport assembly, the service floor being defined at a height that is less than a height of a fabrication facility floor in which the system is disposed.
Bibliography:Application Number: TW20165133372