Method and device for winding long substrate, and long substrate surface processing device provided with winding device

Provided is a method for winding a long substrate in which a banded pattern does not readily occur in both end portions of a wound long substrate. A method for winding a long substrate, for winding a long resin film or other long substrate conveyed in roll-to-roll fashion on a cylindrical winding co...

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Bibliographic Details
Main Author TANBA, HIRONORI
Format Patent
LanguageChinese
English
Published 01.07.2017
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Summary:Provided is a method for winding a long substrate in which a banded pattern does not readily occur in both end portions of a wound long substrate. A method for winding a long substrate, for winding a long resin film or other long substrate conveyed in roll-to-roll fashion on a cylindrical winding core, wherein both end parts in the width direction of the long substrate are wound so as to be positioned farther from a central axis of rotation of the winding core than a center part in the width direction, preferably 50-200 [mu]m farther at a distal end part of the long substrate wound first in contact with an external peripheral face of the winding core during winding of the long substrate on the winding core.
Bibliography:Application Number: TW20165134022