Method and device for winding long substrate, and long substrate surface processing device provided with winding device
Provided is a method for winding a long substrate in which a banded pattern does not readily occur in both end portions of a wound long substrate. A method for winding a long substrate, for winding a long resin film or other long substrate conveyed in roll-to-roll fashion on a cylindrical winding co...
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Main Author | |
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Format | Patent |
Language | Chinese English |
Published |
01.07.2017
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Subjects | |
Online Access | Get full text |
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Summary: | Provided is a method for winding a long substrate in which a banded pattern does not readily occur in both end portions of a wound long substrate. A method for winding a long substrate, for winding a long resin film or other long substrate conveyed in roll-to-roll fashion on a cylindrical winding core, wherein both end parts in the width direction of the long substrate are wound so as to be positioned farther from a central axis of rotation of the winding core than a center part in the width direction, preferably 50-200 [mu]m farther at a distal end part of the long substrate wound first in contact with an external peripheral face of the winding core during winding of the long substrate on the winding core. |
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Bibliography: | Application Number: TW20165134022 |