Bump structure and manufacturing method thereof

A bump structure including a bump body and a plurality of pores is provided. The pores are distributed in the bump body, wherein diameters of the pores are between 0.05 micrometer and 1 micrometer, and the porosity of the bump body and the pores is between 25% and 75%. A manufacturing method of the...

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Bibliographic Details
Main Authors HSU, TZU-HAN, LU, TUNG-BAO
Format Patent
LanguageChinese
English
Published 16.06.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A bump structure including a bump body and a plurality of pores is provided. The pores are distributed in the bump body, wherein diameters of the pores are between 0.05 micrometer and 1 micrometer, and the porosity of the bump body and the pores is between 25% and 75%. A manufacturing method of the bump structure including the following steps is also provided. A plurality of bubbles are doped into a plating solution. A bump body is formed on a workpiece through the plating solution, and the bubbles are mixed into the bump body, so as to construct a plurality of pores distributed in the bump body, wherein diameters of the pores are between 0.05 micrometer and 1 micrometer, and the porosity of the bump body and the pores is between 25% and 75%.
Bibliography:Application Number: TW20150141549