Method for manufacturing electronic component package

The present invention discloses a method of manufacturing an electronic component package, which is capable of forming shielding trenches or via holes on the sealing resin without causing damages to a substrate or wiring on the substrate. Said method of manufacturing the electronic component package...

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Bibliographic Details
Main Authors MIURA, MUNEO, OKADA, HIROKAZU
Format Patent
LanguageChinese
English
Published 01.06.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention discloses a method of manufacturing an electronic component package, which is capable of forming shielding trenches or via holes on the sealing resin without causing damages to a substrate or wiring on the substrate. Said method of manufacturing the electronic component package is characterized in that on the surface of the sealing resin that seals electronic components and electrode pads configured on a substrate, trenches or holes are formed for reaching the electrode pads, and the method comprises: a first step of using a die molding to form, on the surface of the sealing resin at positions for forming the trenches or holes, prepared trenches or prepared holes that do not reach the electrode pads; and a second step of processing to increase the depth of the prepared trenches or prepared holes formed in the first step so as to expose the electrode pads.
Bibliography:Application Number: TW20176100987