Semiconductor device
An object of the present invention is to improve the reliability of a semiconductor device. A semiconductor device has a first lead group comprised of a plurality of first leads, a second lead group comprised of a plurality of second leads, and a first suspension lead arranged between the first lead...
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Main Author | |
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Format | Patent |
Language | Chinese English |
Published |
16.05.2017
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Subjects | |
Online Access | Get full text |
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Summary: | An object of the present invention is to improve the reliability of a semiconductor device. A semiconductor device has a first lead group comprised of a plurality of first leads, a second lead group comprised of a plurality of second leads, and a first suspension lead arranged between the first lead group and the second lead group. Further, the semiconductor device has a first tape attached to each of the first leads, the first suspension lead, and some of the second leads, and a second tape attached to each of the second leads. Further, the first tape has a lead holding part attached to each of the first leads, and a tape supporting part attached to the first suspension lead and some of the second leads and is attached to a position farther from wire connecting portion than the lead holding part. |
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Bibliography: | Application Number: TW20165123583 |