Polyurethane CMP pads having a high modulus ratio
A chemical-mechanical polishing pad comprising a polyurethane polishing layer having a high storage modulus at low temperatures and a low storage modulus at high temperatures is disclosed. For example, the disclosed pad embodiments may be fabricated from a thermoplastic polyurethane having a ratio o...
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Main Authors | , , , , |
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Format | Patent |
Language | Chinese English |
Published |
16.05.2017
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Subjects | |
Online Access | Get full text |
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Summary: | A chemical-mechanical polishing pad comprising a polyurethane polishing layer having a high storage modulus at low temperatures and a low storage modulus at high temperatures is disclosed. For example, the disclosed pad embodiments may be fabricated from a thermoplastic polyurethane having a ratio of storage modulus at 25 degrees C to storage modulus at 80 degrees C of 50 or more. The thermoplastic polyurethane polishing layer may further optionally have a Shore D hardness of 70 or more, a tensile elongation of 320 percent or less, a storage modulus at 25 degrees C of 1200 MPa or more, and/or a storage modulus at 80 degrees C of 15 MPa or less. |
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Bibliography: | Application Number: TW20165131001 |