Printed circuit board and method of manufacturing the same

Disclosed are a printed circuit board and a method of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a first portion formed on the insulating layer and includi...

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Bibliographic Details
Main Authors CHOI, DAE-YOUNG, LEE, JIN-HAK, LEE, HAN-SU, HWANG, JUNG-HO, SON, KIL-DONG, JEONG, IN-HO, BAE, YUN-MI, LEE, SANG-YOUNG, JEONG, DONG-HUN, KIM, SANG-HWA, JEON, JAE-HOON, KWON, SOON-GYU
Format Patent
LanguageChinese
English
Published 01.03.2017
Subjects
APPARATUS THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:Disclosed are a printed circuit board and a method of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a first portion formed on the insulating layer and including a corner portion of an upper portion which has a predetermined curvature and a second portion formed on the first portion and configured to cover an upper surface of the first portion including the corner portion.
Bibliography:Application Number: TW20165125760