Resin-platinum complex and usage thereof
This resin-platinum complex 100 is provided with resin particles 10 and platinum particles 20, and the platinum particles 20 are immobilized on the resin particles 10. In the resin-platinum complex 100, one portion of the platinum particles 20 may be distributed three-dimensionally on outer layer se...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
01.02.2017
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Subjects | |
Online Access | Get full text |
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Summary: | This resin-platinum complex 100 is provided with resin particles 10 and platinum particles 20, and the platinum particles 20 are immobilized on the resin particles 10. In the resin-platinum complex 100, one portion of the platinum particles 20 may be distributed three-dimensionally on outer layer sections 60 of the resin particles 10. In this case, the one portion of the three-dimensionally distributed platinum particles 20 may be partially exposed outside the resin particles 10, and the remaining portion may be enclosed in the resin particles 10. In the platinum particles 20, enclosed particles 30 that are fully enclosed in the resin particles 10, partially exposed particles 40 each having a segment embedded inside the resin particles 10 and a segment exposed outside the resin particles 10, and surface attached particles 50 attached to the surfaces of the resin particles 10 preferably exist. |
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Bibliography: | Application Number: TW20165121640 |