Chip package

An embedded die package comprising a die having die contract pads in a passivation layer, the die contact pads being coupled to a first side of a feature layer by an adhesive layer, a layer of pillars extending from a second side of the feature layer, the die, feature layer and the layer of pillars...

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Bibliographic Details
Main Authors DROR, HURWITZ, HUANG, ALEX SHI-FU
Format Patent
LanguageChinese
English
Published 16.01.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An embedded die package comprising a die having die contract pads in a passivation layer, the die contact pads being coupled to a first side of a feature layer by an adhesive layer, a layer of pillars extending from a second side of the feature layer, the die, feature layer and the layer of pillars being encapsulated by a dielectric material.
Bibliography:Application Number: TW20165111634