Circuit board structure and method for manufacturing the same

• Main Authors: CHENG, SHIH-LIANG, HU, DYIUNG, CHEN, YU-HUA
• Format: Patent
• Language: Chinese; English
• Published: 16.12.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; TRANSPORTING

A method for manufacturing a circuit board structure is provided. First, a first circuit layer is formed on a carrier. Then, a first dielectric layer is formed on the carrier and the first circuit layer. Then, at least one first hole is formed in the first dielectric layer to expose a part of the first circuit layer. Then, a second dielectric layer is formed on the first dielectric layer and the first circuit layer. Then, at least one ditch and at least one second hole are formed in the second dielectric layer, in which the ditch exposes a part of the first dielectric layer, and the second hole exposes a part of the first circuit layer. Finally, a metal layer is filled in the ditch and the second hole.